Xilence is ready with a new performance CPU cooler, the M606. With a typical aluminum fin tower design, the M606 can handle CPUs with TDPs of up to 150W. It makes use of six heat pipes to convey heat to a dense aluminum fin array, which dissipate heat to the air flow by 120 mm fan. The fan spins a 1500 rpm, and has a frame made of rubber, which dampens noise a little. All current sockets, including LGA 1366, LGA 1156, LGA 775, and AM3/AM2 are supported. The M606 will reach stores soon.

Source: CenterZone.it

ECS is ready with a low-cost ATX motherboard based on the upcoming AMD 880G chipset, the ECS A880GM-A2. The board uses a PCB nearly identical to that of the ECS IC890GXM-A, except for the skimpier heatsinks. The board features a simple 3+1 phase VRM which can power AM3 processors, including the Phenom II X6, with TDPs of up to 125W. Solid-state capacitors are used only for some important circuits. The 880G chipset embeds an ATI Radeon HD 4250 IGP, with 128 MB of DDR3 SidePort Memory. It supports dual-channel DDR3 memory, with speeds of up to 1600 MHz.

Expansion slots include one PCI-Express 2.0 x16, one PCI-E x16 (electrical x4), two PCI-E x1, and two PCI. The SB850 southbridge gives out six SATA 6 Gb/s ports, of which five are internal, and one eSATA. Connectivity options include 8-channel audio, gigabit Ethernet, eSATA and USB 2.0. Display connectivity includes DVI and D-Sub. It is expected to be released next week, at an affordable price.

Source: bit-tech.net