Nexus unveiled an updated design to its FLC-3000 CPU cooler that was launched about three years ago, the FLC-3000 R2. The new version features support for the latest socket types, and makes use of a CPU base with direct-touch heatpipes. The cooler measures 128 x 105 x 119 mm, weighing 450 g, its design consists of a direct-touch heatpipe CPU base from which four 6 mm copper heatpipes convey heat to an aluminum fin array that propagates at an angle of roughly 45°. A 92 mm PWM-controlled, orange LED-lit fan is nested inside the array, which spins at speeds of 900 to 2,500 rpm, with a maximum noise output of 24 dBA. All current socket types are supported, including LGA1366, LGA1156, AM3/AM2+, and LGA775. It is expected to be priced at around $40.

Source: TechConnect Magazine

Xigmatek today introduced its Aegir SD128264 CPU cooler. While it looks like yet another tower-design CPU cooler with push-pull ventilation, Xigmatek implemented a new technology in this cooler, which it calls “Double Layer with Heat-pipe Direct Touch” or DLHDT. The design involves four heatpipes, of which two are 8 mm thick and two are 6 mm thick (alternating), making direct contact with the processor, with another set of two heatpipes making direct contact with these four HDT heat pipes, so that some of the processor’s heat is indirectly offloaded to those heatpipes between the two sets of heat pipes. In all, the six heat pipes disperse heat to various parts of the aluminum fins.

The unit measures 120(W) x 120(H) x 25(D) mm, weighing 630 g. Air circulation is care of two 120 mm fans that guide air through the aluminum fin array at speeds between 1,000 and 2,200 rpm, with a noise level of 20 dBA. The fans are fitted with white LEDs. The cooler supports all current CPU socket types, including LGA1366, LGA1156, AM3/AM2(+), and LGA775. Xigmatek unfortunately, did not give out pricing or availability information.

Corsair is developing a new pre-assembled CPU water cooling kit after facing some market success with the Hydro H50. The new kit, called Hydro H70, features a more optimized coolant flow design, an improved CPU base made of copper, and a denser radiator. It makes use of two 120 mm fans on either sides of the radiator, pushing at 1,600 rpm, and pulling at 2,000 rpm. The design increases the cooler’s TDP capacity, closer to elaborate water cooling loops, potentially increasing the processor’s overclocking headroom. The Hydro H70 is compatible with all current CPU socket types, including LGA1366, LGA1156, AM3/AM2(+), and LGA775. UK-based online store Scan.co.uk has these up for pre-order at £65.70 (£77.20 incl. VAT). It is indicated that Corsair will officially release these next week.

Source: Hexus.net

The third member in Antec’s KÜHLER series of CPU coolers has come to like, following KÜHLER Shelf and KÜHLER Flow. The new KÜHLER is called “Box”, and sports a dual aluminum fin tower design that places it on top of Antec’s catalogue. The design consists of a CPU base and heatsink, from which eight copper heat pipes convey heat to two aluminum fin blocks. Between the two blocks is a 120 mm PWM-controlled fan that circulates air. The cooler measures 148 (H) x 122 (W) x 120 (D) mm, weighing all of 1.2 kg (2.65 lbs). It supports all current CPU socket types, including LGA1366, LGA1156, AM3, and LGA775. It is priced at US $66.

Source: TechConnect Magazine

Koolance rolled out its newest CPU water-block, the CPU-360. The new block boasts of broad compatibility with all current CPU socket types, an advanced microfin cold plate with 0.25mm fins, 0.30 mm channels, and an optimized flow path. The cold plate is complemented with a brass top, all metal surfaces have nickel plating to minimize corrosion. The block measures 4.9″ x 4.9″ x 0.6″ (12.5cm x 12.5cm x 1.5xcm), and weighs 411 g (14.5 oz). While the package excludes nozzles, it includes all the retention material needed for Intel sockets LGA-775, LGA-1156, LGA-1366, and AMD sockets AM3/AM2+/AM2. The CPU-360 is listed on Koolance website at US $84.99.