Kingston Technology Europe Ltd, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced that the Romanian overclocking team, Lab501 achieved three new world records with the world’s fastest dua…

Team Group Inc. gives enthusiasts the best present of the year that is Releasing 4 masterpieces of OC memory all in one, including Quad-Channel memory which is compatible with the latest Intel X79 platform, and the highest-level Dual-Channel memory on …

Chinese company JEHE is launching its latest compact mini-ITX motherboard in Europe under the Giada brand, the MI-Z68. As the name suggests, it is based on Intel Z68 chipset, and supports Core i3/i5/i7 processors in the LGA1155 package. There is no TDP…

SAPPHIRE Technology, a leading manufacturer and global supplier of graphics, mainboard and multimedia solutions has just introduced a new mainboard developed to support the latest SandyBridge family of CPU’s from Intel.

The SAPPHIRE Pure Platinum Z68 …

Apacer, one of the world’s leading brands of memory modules, today announced an expansion of its ARES overclocking memory series with high capacity and clock rate: DDR3-2133 8GB (4GBx2) dual channel memory kit,which is engineered for the latest Intel P…

Stores in Taiwan have started stocking up on Gigabyte’s latest high-end LGA1155 motherboard, the GA-Z68X-UD7 B3. Based on the new Z68 chipset that combines the overclocking capabilities of P67 with the Flexible Display Interface (FDI) feature of H67, Z…

Gigabyte sneaked in its latest motherboard for SFF (small form-factor) fans, the GA-H67N-USB3-B3. This mini-ITX motherboard supports socket LGA1155 Intel Core processors, and is based on the Intel H67 chipset (B3 revision). The board supports every LGA1155 Core processor released till date, its designers didn’t have to worry much about its electricals since you’re not going to overclock on H67. Yet, the board packs a 4+2 phase VRM for the CPU, that’s compliant with Intel’s VRD 12 specification. The socket is wired to two DDR3 DIMM slots for dual-channel memory support, and a PCI-Express 2.0 x16 slot.

In the storage department, there are two SATA 6 Gb/s ports from the chipset, two SATA 3 Gb/s, and one eSATA 3 Gb/s, also from the chipset. Its display connectivity surprisingly includes two HDMI ports, and one D-Sub. Audio is care of the high-grade Realtek ALC889 HDA CODEC, which can deliver 108 dB signal-to-noise ratio, the board also provides coaxial and optical SPDIF output connectivity. Other connectivity includes two USB 3.0 ports, gigabit Ethernet, and a number of USB 2.0 ports. The board features dual-BIOS with an EFI module that allows you to boot from a 3 TB+ volume. Gigabyte’s H67N-USB3-B3 is expected to be priced around the $120 mark. This one for the HTPC.

Here are the first pictures of MSI Z68A-GD80 (B3), the company’s first socket LGA1155 motherboard based on Intel’s new Z68 PCH. Intel is weeks away from launching the Z68 PCH, which is a middle-ground between P67 and H67. P67 let you overclock, while it didn’t feature Flexible Display Interface (FDI); H67 featured FDI, but didn’t let you overclock. Z68 features FDI, it also lets you overclock to the potential of P67. MSI’s Z68A-GD80 makes use of the B3 revision of the Z68 PCH. It intends to offer loads of overclocking features, ample discrete GPU expansion, as well as FDI connectivity to let you use the processor-embedded graphics.

The LGA1155 socket supports 2011 Core i5/i7 “Sandy Bridge” processors. The LOTES-made socket on the Z68A-GD80 is powered by a 15-phase VRM that uses “solid-state” chokes that don’t buzz on load. The VRM is cooled by two heatsinks that share heat over a heat pipe. The socket is wired to four DDR3 DIMM slots that support dual-channel memory. Expansion slots include three PCI-Express x16 (electrical x16/NC/x4 or x8/x8/x4), two PCI-E x1, and two PCI.

Apart from the 3.70 Phenom II X4 980, AMD’s next, and probably (hopefully) final wave of Phenom II processors will include a 3.50 GHz clocked dual-core part, the Phenom II X2 570 Black Edition. This socket AM3 chip will be based on the “Callisto” silicon, which is essentially a “Deneb” quad core die used in X4 parts, with two of its four cores disabled. The chip features two cores clocked at 3.50 GHz (17.5 x 200 MHz), 512 KB dedicated L2 caches per core, and 6 MB shared L3 cache. The integrated dual-channel memory controller supports DDR3-1333 MHz on AM3 socket, and DDR2-1066 MHz on AM2+. As a Black Edition part, the BClk multiplier is unlocked, to help with overclocking. At these speeds, the TDP is rated at 80W.

Source: DonanimHaber

AMD is looking to give its Phenom II series a finale, with a new quad-core Phenom II X4 model, the Phenom II X4 980 Black Edition. The new chip will be clocked at 3.70 GHz out of the box (18.5 x 200 MHz). It achieves this speed while staying within the 125W TDP envelope. Based on the 45 nm “Deneb” silicon, the X4 980 BE features four x86-64 cores with 512 KB dedicated L2 cache each, and a 6 MB shared cache. Compatible with AM3 and AM2+ sockets, the chip packs a dual-channel memory controller that supports DDR3-1333 MHz or DDR2-1066 MHz memory standards. AMD will unveil the new chip soon, as the company gears up to launch next-generation chips in June.

Source: DonanimHaber