Japanese manufacturer Scythe officially announces the new CPU Cooler Rasetsu. This cooler, already shown at the CeBit 2010, combines the outstanding design of the Yasya CPU Cooler with a top-flow layout. The heatsink is divided into two blocks, and each is equipped with the T.M.L.F. (Trident Multi Layer Fin) structure. Because of this irregular lamellar structure and the unparallel arrangement of six copper heatpipes, surface directly cooled by the fan is highly increased and thus maximum heat dissipation is achieved.

New 120 mm “Slip Stream 120 PWM Adjustable” fan is supplied for optimized airflow. Although the fan supports the PWM feature, user can manually adjust the bandwidth between 470 to 1,370 rpm and 740 to 1,900 rpm. Easy mounting is available by the famous V.T.M.S. (Versatile Tool-Free Multiplatform System) which requires no motherboard removal for the heatsink mounting. Rasetsu CPU Cooler is compatible to all current sockets, including the new socket LGA 1156, LGA 1366 and AM3.

Nexus unveiled an updated design to its FLC-3000 CPU cooler that was launched about three years ago, the FLC-3000 R2. The new version features support for the latest socket types, and makes use of a CPU base with direct-touch heatpipes. The cooler measures 128 x 105 x 119 mm, weighing 450 g, its design consists of a direct-touch heatpipe CPU base from which four 6 mm copper heatpipes convey heat to an aluminum fin array that propagates at an angle of roughly 45°. A 92 mm PWM-controlled, orange LED-lit fan is nested inside the array, which spins at speeds of 900 to 2,500 rpm, with a maximum noise output of 24 dBA. All current socket types are supported, including LGA1366, LGA1156, AM3/AM2+, and LGA775. It is expected to be priced at around $40.

Source: TechConnect Magazine

Xigmatek today introduced its Aegir SD128264 CPU cooler. While it looks like yet another tower-design CPU cooler with push-pull ventilation, Xigmatek implemented a new technology in this cooler, which it calls “Double Layer with Heat-pipe Direct Touch” or DLHDT. The design involves four heatpipes, of which two are 8 mm thick and two are 6 mm thick (alternating), making direct contact with the processor, with another set of two heatpipes making direct contact with these four HDT heat pipes, so that some of the processor’s heat is indirectly offloaded to those heatpipes between the two sets of heat pipes. In all, the six heat pipes disperse heat to various parts of the aluminum fins.

The unit measures 120(W) x 120(H) x 25(D) mm, weighing 630 g. Air circulation is care of two 120 mm fans that guide air through the aluminum fin array at speeds between 1,000 and 2,200 rpm, with a noise level of 20 dBA. The fans are fitted with white LEDs. The cooler supports all current CPU socket types, including LGA1366, LGA1156, AM3/AM2(+), and LGA775. Xigmatek unfortunately, did not give out pricing or availability information.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the Corsair Hydro Series™ H70 ultra-performance CPU cooler. This CPU cooler is designed to provide an extremely efficient cooling solution for CPUs from Intel and AMD.

The Hydro Series H70 CPU cooler is an evolution of the award-winning Hydro Series H50, with several significant upgrades that enable it to deliver even greater cooling performance. These upgrades include a double-thickness (50mm) radiator with higher heat-exchanging capacity and a pump/cold plate unit with increased efficiency. The H70 also features two 120mm speed-switchable cooling fans in a push-pull configuration to provide increased airflow at low noise levels.

Corsair is developing a new pre-assembled CPU water cooling kit after facing some market success with the Hydro H50. The new kit, called Hydro H70, features a more optimized coolant flow design, an improved CPU base made of copper, and a denser radiator. It makes use of two 120 mm fans on either sides of the radiator, pushing at 1,600 rpm, and pulling at 2,000 rpm. The design increases the cooler’s TDP capacity, closer to elaborate water cooling loops, potentially increasing the processor’s overclocking headroom. The Hydro H70 is compatible with all current CPU socket types, including LGA1366, LGA1156, AM3/AM2(+), and LGA775. UK-based online store Scan.co.uk has these up for pre-order at £65.70 (£77.20 incl. VAT). It is indicated that Corsair will officially release these next week.

Source: Hexus.net

The third member in Antec’s KÜHLER series of CPU coolers has come to like, following KÜHLER Shelf and KÜHLER Flow. The new KÜHLER is called “Box”, and sports a dual aluminum fin tower design that places it on top of Antec’s catalogue. The design consists of a CPU base and heatsink, from which eight copper heat pipes convey heat to two aluminum fin blocks. Between the two blocks is a 120 mm PWM-controlled fan that circulates air. The cooler measures 148 (H) x 122 (W) x 120 (D) mm, weighing all of 1.2 kg (2.65 lbs). It supports all current CPU socket types, including LGA1366, LGA1156, AM3, and LGA775. It is priced at US $66.

Source: TechConnect Magazine

Antec has started selling the KÜHLER Flow CPU cooler, a variant of the recently released KÜHLER Shelf. Measuring 122 (H) x 157 (W) x 108 (D) mm, it weighs 700 g, and uses a aluminum fin tower design with a slight change: that it’s not right over the CPU base. This way, the 120 mm fan does not protrude into the memory slot area of the motherboard. Heat is conveyed to the aluminum fins by 7 copper heat pipes. The cooler supports all current CPU sockets, including LGA1366, LGA1156, AM3, and LGA775. The Australian etailer that listed the cooler priced it at AU $74 (US $65).

Source: TechConnect Magazine

Glacialtech, known more for its OEM-replacement and value-ended CPU coolers, sometimes takes the time off to release audaciously-designed performance CPU coolers, such as the UFO V51. It seems to be the case with the Igloo 5751 PWM, the latest in the making. The Igloo 5751 PWM uses a CPU base in which four 6 mm thick heat pipes make direct contact with the CPU, capped with an aluminum heatsink, with the heat pipes conveying heat to an aluminum fin array that propagates along the plane of the motherboard, covered with metal plates on four sides, and two 92 mm fans on two.

It measures 100 (W) x 135 (L) x 130 (H) mm, weighing 550 g. The fan on the top spins at 1400 rpm, while the one on the bottom spins at speeds between 800 and 1800 rpm, controllable by PWM. The Igloo 5751 PWM supports all current CPU sockets, including LGA1366, LGA1156, AM3/2(+), and LGA775. A tube of Glacialtech IceTtherm II thermal compound comes bundled. The company did not give out a price, though one can expect it to be moderately priced.

Source: TechConnect Magazine

Prolimatech is out with a new high-end CPU air-cooler, the Super Mega. The pile of adjectives aside, this cooler is based on the design of its popular Megahalems dual fin-block tower design, except for a dash of copper fins sandwiched between aluminum fins. Measuring (L)130mm X (W)74mmX (H)158.7 mm, and weighing in at 945.3 g, the Super Mega uses six 6 mm thick nickel-plated copper heat pipes to convey heat to two independent aluminum-copper fin blocks, which make up the shape of a conventional tower cooler, but increase turbulence. The cooler can hold 120 mm and 140 mm fans on either sides, and supports all latest CPU sockets, including LGA1366, LGA1156, and LGA775. Prolimatech did not give out a price.

Source: Benchmark Reviews

The Japanese cooling specialist Scythe Co., Ltd. (Tokyo, Japan) officially announces the long-awaited successor of the Ninja 2 Rev. B CPU Cooler. New Scythe Ninja 3 CPU cooler, which was already shown at CeBIT 2010 in March 2010, offers the revised design as well as better performance than its predecessor for both active and passive operations.

The optimized structure of the aluminum fins allows, in cooperation with eight U-shaped copper heatpipes, increased heat dissipation of 7% for passive operation compared to the previous model. However for active cooling, the M.A.P.S. (Multiple Airflow pass-through structure) guarantees the high performance. A fully nickel-plated copper base-plate provides direct absorption of heat from the CPU.